Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows

ABSTRACT

The invention relates to a method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows. Various light-setting materials are used for the production of the layers. Upon exchanging the materials, those layer regions in which no setting occurred during the preceding setting process, are also filled with new material, such that, in the subsequent setting process, not only is the upper layer linked to the one lying directly beneath it, but also material of the upper layer is connected to the material of a layer lying below the penultimate layer. It is thus possible, within the layer sequence, to connect a structure with varying properties from layer to layer.

[0001] The present invention relates to a method for producingthree-dimensionally arranged conducting and connecting structures forvolumetric and energy flows. The volumetric flows may be gaseous, liquidor solid, or may consist of a mixture of said states of aggregation. Theenergy flows may be of an acoustic, electric, magnetic orelectromagnetic nature.

[0002] Such volumetric and energy flows are realized at the present timewith the help of many different technologies, as a rule. Conductor pathsand bond wires are the most frequently employed paths of transportationin the field of microsystem technology. In addition to hollowconductors, glass fibers are used for transporting electromagneticenergies as well. Volumetric flows are realized by way of channels,hoses and pipelines. With increasing miniaturization, it is possibleonly with great difficulty to still combine such conducting andconnecting elements.

[0003] The problem is solved by the invention by using a structured,layered build-up. Methods for building up layers are known from thefield of microtechnology. DE-PS 44 20 996, for example, describes amethod in connection with which a small amount of the light-settingplastic is maintained between two parallel boards due to the surfacetension, with at least one of said boards being permeable toelectromagnetic waves. The surface of the plastic liquid located belowthe board that is permeable to electromagnetic waves, is cured, forexample by means of a laser beam that is guided across the surfaceaccording to a 3-layer model of the structure to be generated. The modelis stored in a connected computer. The laser light cures the plasticliquid layer by layer in accordance with the 3D layer model, whereby thespacing of the boards is increased in each step by one layer thickness,so that fresh plastic material can continue to flow into theintermediate space being created between the cured layer and the boardsolely on account of its surface tension. Structures can be produced inthis way with high accuracy in the micrometer range.

[0004] Said technology is employed by the invention.

[0005] Different light-setting materials are employed by the inventionfor producing the layers. Such materials may have all kinds of differentphysical, chemical and biological properties. For example, the materialsmay be electrically conductive or electrically insulating, and they mayhave different optical refraction indices. When the materials areexchanged, the layer segments where no setting occurred in the precedingsetting process, are filled with new material, so that in the subsequentsetting process, not only the uppermost layer is connected to the onelying directly underneath it, but material of the uppermost layer isconnected also to the material of a layer lying underneath thesecond-last layer. Thus it is possible within the layer sequence toconnect a structure with varying material properties from layer tolayer. For volumetric transport, these are uncured areas which,following setting and the flushing process, are available as channels.Said channels can be used also as hollow conductors for high frequencyapplication if the walls of the channels are produced from material thathas properties suitable for said purpose.

[0006] Furthermore, light-conducting structures can be produced withmaterials with different refractive indices. Such light-conductingstructures can be employed in conjunction with light transistors (keyword: light switches light) for producing optical integrated circuits.

[0007] Conventional integrated circuits (IC's) can be connected to eachother in this manner as well because if an IC has been integrated in acavity underneath the last surface, it is possible to produce via theconnections (pads) a channel with conductive material that can then beextended up to another IC, or also to plug connectors that have beenproduced in this manner.

1. A method for producing three-dimensionally arranged conducting andconnecting structures for volumetric and energy flows, whereby differentlight-setting materials are employed for producing the layers. When thematerials are exchanged, also the layer areas where no setting hasoccurred in the preceding setting process, are filled with new materialas well, so that in the subsequent setting process, not only theuppermost layer is connected with the one lying directly below it, butmaterial of the uppermost layer is connected also to the material of alayer lying below the second-last layer. Thus it is possible within alayer sequence to connect a structure with varying properties from layerto layer.
 2. The method according to claim 1, characterized by thefollowing steps of the method: (a) A structured layer is generated bystructured prefabrication of a liquid, light-setting material withselected physical, chemical or biological properties. (b) The structuredlayer is cleaned of the uncured material by means of a flushing process,filled with liquid, light-setting material with other physical, chemicalor biological properties, and covered with a defined layer thicknessaccording to DE-PS 44 20
 996. (c) Areas of the first layer and the newlayer are cured in a structured manner by structured solidification. (d)The structured layers are cleaned of uncured material of the laststructuring by means of a flushing process, filled with liquidlight-setting material with other physical, chemical and biologicalproperties, and covered with a defined layer thickness according toDE-PS 44 20
 996. (e) Areas of the second layer and the new layer arecured in a structured manner by structured solidification, generating inthis manner a connection of materials with the same physical, chemicalor biological properties, or an insulation of said materials. (f) Thestructured layers are cleaned of the uncured materials of the laststructuring by means of a flushing process. (g) Areas not filled withmaterial are fitted with electronic, mechanical, optical or chemicalcomponents according to the system to be produced. (h) The structuredlayers and the components are filled with liquid, light-setting materialwith other physical, chemical and biological properties, and coveredwith a defined layer thickness according to DE-PS 44 20
 996. (i) Areasof the second-last layer and the new layer are cured in a structuredmanner by structured solidification, generating in this manner aconnection of materials and components with the same physical, chemicalor biological properties, or an insulation of such materials andcomponents.
 3. The method according to claim 2, characterized in thatseveral electronic, mechanical, chemical or biological/electricalcomponents are connected to each other.
 4. The method according to claim3, characterized in that the connections between the components and theenvironment of the system can be used for volumetric and energy flows.